| PART |
Description |
Maker |
| ZX360D-B-10P |
RECOMMENDED PANEL CUTOUT PCB LAYOUT FOR REFERENCE
|
Hirose Electric
|
| AN10778 |
PCB layout guidelines for NXP MCUs in BGA packages
|
NXP Semiconductors
|
| 35W000 16-35W000-10 18-35W000-10 24-35W000-10 28-3 |
A cost-effective means of upgrading to SOIC without changing your PCB layout
|
Aries Electronics, Inc.
|
| VSC8201 |
Design Considerations
|
Vitesse
|
| AB20-3 |
Electrical Design Considerations for SuperFlux LEDs
|
Lumileds Lighting Company
|
| CPWR-AN08 |
Application Considerations for Silicon Carbide MOSFETs
|
Cree, Inc
|
| AN1149-3 |
Electrical Design Considerations for SuperFlux LEDs
|
Lumileds Lighting Company
|
| AN-1026 |
High Speed Differential ADC Driver Design Considerations
|
Analog Devices
|
| MPC823 |
This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for the MPC823.
|
Freescale Semiconductor...
|
| LSSHS-5-04 |
Recommended P.C.B.Layout
|
Major League Electronics
|
| AN-5061 |
Layout Guidelines
|
Fairchild Semiconductor Corporation
|
